Chipworks reverse engineering reveals that Apple iPhone SE FaceTime front-facing camera uses Omnivision 1.2MP sensor with pixel pitch of 1.75 µm. The die, which features OV2E0BNN die markings, has a size of 4.3 mm x 4.1 mm (17.6 mm2):
The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip:
The rear camera contains a Sony stacked (Exmor RS) sensor with a 6.02 mm x 4.83 mm (29.1 mm2) die size. The pixel pitch is 1.22 µm, as was used for the iPhone 6s/6s Plus. The decapsulated die photos from the SE and 6s Plus rear image sensors appear to be the same chip:
iPhone SE Features Sony and Omnivision Sensors
Reviewed by MCH
on
April 02, 2016
Rating:
Reviewed by MCH
on
April 02, 2016
Rating:
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