Qualcomm and Himax Collaborate on 3D Sensing

PRNewswire, GlobeNewsWire: Qualcomm and Himax jointly announce a collaboration on low power active 3D depth sensing camera for use cases such as biometric face authentication, 3D reconstruction, and scene perception for mobile, IoT, surveillance, automotive and AR/VR.

Qualcomm expertise in computer vision and algorithm with Himax's technologies in wafer optics, sensing, driver, and module integration are combined in a fully integrated SLiM (Structured Light Module) 3D solution. The SLiM is a turn-key 3D camera module that delivers real-time depth sensing and 3D point cloud generation with high resolution and high accuracy for indoor and outdoor environments. Qualcomm and Himax will commercialize the SLiM for a wide array of markets and industries with mass production targeting in Q1/2018.

"Our 3D sensing solution will be a game changing technology for smartphones, where we will enable the Android ecosystem to provide the next generation of mobile user experience," said Jordan Wu, President and CEO of Himax. "Our two companies have worked together for more than four years to design the SLiM 3D sensing solution to meet growing demands for enhanced computer vision capabilities that will enable amazing new features and use cases in a broad range of markets and applications. We are pleased to partner with Qualcomm Technologies to put together an ecosystem and to enable the revolutionary computer vision solutions for our customers globally in a timely fashion."