KLA-Tencor Helps Toppan to Get 300mm Wafer Capability

Yahoo: KLA-Tencor announced that its 8900 defect inspection system was recently installed at the first 300mm advanced CFA fab of Toppan. Key features of the new 8900 defect inspection system include:

• Simultaneous brightfield and darkfield optical paths to capture a wide range of defect types in a single pass, such as micro-lens deformation; resist and fall-on defects; color contamination; large stains and striations;
• Selectable LED inspection and review illumination spectrum matched to CIS filter colors;
• Sensitivity consistent with requirements of advanced CIS roadmaps;
• Throughput above 110 wafers per hour at production sensitivity, for 300mm semiconductor wafers;
• Automated binning of defects by type;
• Automated sensor pass/fail dispositioning; and
• Automated color review for defect verification.