SEMI European Imaging & Sensors Summit 2017

SEMI European Imaging & Sensors Summit 2017 is to be held on September 20-22 in Grenoble, France. The summit agenda has many interesting presentations:

• Sensor as a solution
  Chae Lee, Senior VP, LG Electonics
• In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
  Marie Noelle Semeria, CEO, Cea-Leti
• 3D Time-of-Flight Cameras in Industrial Applications
  Thomas Kuhnke, Senior Electronics Design Engineer, 3D Business, Basler AG
• Hybrid semiconductor direct conversion CMOS x-ray imaging detectors with application examples
  Tuomas Pantsar, Chief Technology Officer / Charge Integration, Oy Ajat
• CMOS based microdisplays, imager and sensors enhanced by OLED/OPD integration
  Philipp Wartenberg, IC Design Engineer and Project Manager / Deputy head of department IC and System Design, Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP
• TSMC Imaging Technology to Enable Innovation in AR/VR Applications
  Tripti Bhanti, Senior Technical Manager, TSMC Europe BV
• Fusion Bonding Enabler for Backside Illuminated Image Sensors - What’s Next
  Thomas Uhrmann, Director of Business Development, EVG
• Technological Trends in Thermal Image Sensors
  Christel-loic Tisse, Technical & Innovation Director, ULIS
• Packaging of Image Sensors and Devices
  Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH
• Image Fusion: How to Best Utilize Dual Cameras
  Roy Fridman, Director of Product Marketing, Corephotonics
• High Performance CMOS Integrated Graphene Photodetectors
  Tapani Ryhänen, CEO, Emberion
• CMOS image sensor for bio-medical and scientific applications
  Renato Turchetta, CEO, IMASENIC
• New developments in logarithmic pixels and sensors
  Yang Ni, Founder & CTO, NIT
• Colour X-ray Imaging Solutions for Non-Destructive Testing based on Photon Counting Technology
  Juha Kalliopuska, Chief Executive Officer and Co-founder, ADVACAM
• High resolution global shutter image sensors for machine vision and 8K video
  Guy Meynants, Engineering Fellow, ams/CMOSIS
• VTT’s hyperspectral imaging technology - from high-performance applications towards volume scalability
  Anna Rissanen, Research Team Leader, VTT
• Image Sensors for Future VR
  Yiwan Wong, Partnership Lead, Oculus Research
• Ambient Sensing – New ways how intelligent devices can cope with the environment
  Roland Helm, Segment Head Sensors, Infineon Technologies AG