SystemPlus publishes a reverse engineering report on FLIR Boson low-cost LWIR camera module:
"The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320×256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
The thermal camera uses 12µm pixels based on a vanadium oxide technology microbolometer, the ISC1406L, which features a 320×256 resolution and wafer-level packaging (WLP) to achieve a very compact design. The die is half the size of the one in the oldest ISC0901 model, but gives the same definition."
"The FLIR Boson camera core occupies only 4.9cm3 without its lens, including a 320×256 pixel microbolometer and an advanced processor. The system is made very compact and easy for integrators to handle. It includes a new chalcogenide glass for the lens and a powerful Vision Processing Unit for the first time.
The thermal camera uses 12µm pixels based on a vanadium oxide technology microbolometer, the ISC1406L, which features a 320×256 resolution and wafer-level packaging (WLP) to achieve a very compact design. The die is half the size of the one in the oldest ISC0901 model, but gives the same definition."
FLIR Boson Teardown
Reviewed by MCH
on
September 24, 2017
Rating:
Reviewed by MCH
on
September 24, 2017
Rating:
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