BusinessWire, BusinessWire: Omnivision announces 20MP OV20880 and OV20880-4C and 16MP OV16885 and OV16885-4C stacked sensors featuring 1.008um PureCel Plus-S pixels.
OmniVision’s second-generation PureCelPlus technology has a number of performance improvements, including:
The OV20880 is also optimized for mobile dual-camera zoom solutions, offering several dual-camera-friendly features such as context switching, scalar, and EIS. The on-chip EIS can synchronize with a gyro sensor on-board without latency, enabling advanced capabilities such as image deblur.
The OV20880-4C and OV16885-4C unique CFA pattern offers a variety of output modes depending on the use case. The on-chip in-pixel binning feature allows up to four times more light photons than a regular 1.0-micron pixel. The OV20880-4C also pairs well with OmniVision's complete software solution for resolution recovery that enables high-resolution 16MP and 20MP selfies when combined with the sensor's 4-cell mode.
The OV20880, OV20880-4C, OV16885 and the OV16885-4C are currently available for sampling and are expected to enter volume production in Q1 2017.
OmniVision’s second-generation PureCelPlus technology has a number of performance improvements, including:
- 20% increase in FWC, enabling higher DR.
- A newly introduced composite metal grid (CMG) structure, which increases QE and enhances sensor low-light performance, leading to a 12.5% improvement in sensitivity.
- Improved deep trench isolation (DTI) structure, which further reduces color crosstalk and improves the SNR10 figure by 10 lux.
- These structure improvements also enable small-pixel sensors to have better tolerance to incident light angles. This in turn allows imaging systems to use lower F-number lenses for better brightness, and to realize lower module heights that are essential for slimmer phone designs.
The OV20880 is also optimized for mobile dual-camera zoom solutions, offering several dual-camera-friendly features such as context switching, scalar, and EIS. The on-chip EIS can synchronize with a gyro sensor on-board without latency, enabling advanced capabilities such as image deblur.
The OV20880-4C and OV16885-4C unique CFA pattern offers a variety of output modes depending on the use case. The on-chip in-pixel binning feature allows up to four times more light photons than a regular 1.0-micron pixel. The OV20880-4C also pairs well with OmniVision's complete software solution for resolution recovery that enables high-resolution 16MP and 20MP selfies when combined with the sensor's 4-cell mode.
The OV20880, OV20880-4C, OV16885 and the OV16885-4C are currently available for sampling and are expected to enter volume production in Q1 2017.
Omnivision Stacked Sensors Feature 1.008um DTI BCFA CMG Pixel with zHDR
Reviewed by MCH
on
November 08, 2016
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