With a proliferation of FinFETs and other 3D devices, it's just a matter of time to see them adapted in image sensors. Apple patent application US20140211056 "Vertically stacked image sensor" by Xiaofeng Fan seems to propose exactly that:
Apple Proposes Stacked Sensor with Vertical TG
Reviewed by MCH
on
August 07, 2014
Rating:
Reviewed by MCH
on
August 07, 2014
Rating:
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