SMIC Opens Center for Vision, Sensors and 3DIC

PRNewswire, EETimes: SMIC announces the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D). CVS3D consolidates SMIC's R&D and manufacturing capabilities for silicon-based sensors, TSV and other middle-end wafer process (MEWP) technologies. MEWP technology has led to significant advancements in CMOS image sensors, 3D stacked devices, and high performance TSV-based 2.5D and 3D systems-in-package (SiP). The formation of CVS3D is a strategic step in SMIC's technology differentiation strategy as SMIC expands its technology offerings to a global customer base. One of SMIC customers is said to be already in production using CVS3D's technology offerings, a few customers have multiple additional products in qualification.