Image Sensors at ISSCC 2013

ISSCC 2013 published its advance program with many image sensor papers, including Sony stacked sensor presentation:

A 1/4-inch 8Mpixel Back-Illuminated Stacked CMOS Image Sensor
S. Sukegawa, T. Umebayashi, T. Nakajima, H. Kawanobe, K. Koseki, I. Hirota, T. Haruta, M. Kasai, K. Fukumoto, T. Wakano, K. Inoue, H. Takahashi, T. Nagano, Y. Nitta, T. Hirayama, N. Fukushima
Sony, Atsugi, Japan;
Sony LSI Design, Atsugi, Japan
Sony Semiconductor, Kumamoto, Japan

A 3.4µW CMOS Image Sensor with Embedded Feature-Extraction Algorithm for Motion-Triggered Object-of-Interest Imaging
J. Choi, S. Park, J. Cho, E. Yoon, University of Michigan, Ann Arbor, MI

A 467nW CMOS Visual Motion Sensor with Temporal Averaging and Pixel Aggregation
G. Kim, M. Barangi, Z. Foo, N. Pinckney, S. Bang, D. Blaauw, D. Sylvester University of Michigan, Ann Arbor, MI

A Rolling-Shutter Distortion-Free 3D Stacked Image Sensor with -160dB Parasitic Light Sensitivity In-Pixel Storage Node
J. Aoki, Y. Takemoto, K. Kobayashi, N. Sakaguchi, M. Tsukimura, N. Takazawa, H. Kato, T. Kondo, H. Saito, Y. Gomi, Y. Tadaki, Olympus, Hachioji, Japan

An 8×16-pixel 92kSPAD Time-Resolved Sensor with On-Pixel 64ps 12b TDC and 100MS/s Real-Time Energy Histogramming in 0.13µm CIS Technology for PET/MRI Applications
L. H. Braga, L. Gasparini, L. Grant, R. K. Henderson, N. Massari, M. Perenzoni, D. Stoppa, R. Walker
Fondazione Bruno Kessler, Trento, Italy
STMicroelectronics, Edinburgh, UK
University of Edinburgh, Edinburgh, UK

A 0.18µm CMOS SoC for a 100m-Range 10fps 200×96-Pixel Time-of-Flight Depth Sensor
C. Niclass, M. Soga, H. Matsubara, M. Ogawa, M. Kagami
Toyota Central R&D Labs, Nagakute, Japan

3D Camera Based on Linear-Mode Gain-Modulated Avalanche Photodiodes
O. Shcherbakova, L. Pancheri, G-F. Dalla Betta, N. Massari, D. Stoppa
University of Trento, Trento, Italy.
Fondazione Bruno Kessler, Trento, Italy

A 3D Vision 2.1Mpixel Image Sensor for Single-Lens Camera Systems
S. Koyama, K. Onozawa, K. Tanaka, Y. Kato
Panasonic, Nagaokakyo, Japan

A 187.5µVrms-Read-Noise 51mW 1.4Mpixel CMOS Image Sensor with PMOSCAP Column CDS and 10b Self-Differential Offset-Cancelled Pipeline SAR-ADC
J. Deguchi, F. Tachibana, M. Morimoto, M. Chiba, T. Miyaba, H. Tanaka, K. Takenaka, S. Funayama, K. Amano, K. Sugiura, R. Okamoto, S. Kousai
Toshiba, Kawasaki, Japan;
Toshiba Microelectronics, Kawasaki, Japan

A 94GHz 3D-Image Radar Engine with 4TX/4RX Beamforming Scan Technique in 65nm CMOS
P-N. Chen, P-J. Peng, C. Kao, Y-L. Chen, J. Lee
National Taiwan University, Taipei, Taiwan

A [10°C ; 70°C] 640×480 17µm Pixel Pitch TEC-Less IR Bolometer Imager with Below 50mK and Below 4V Power Supply
B. Dupont, A. Dupret, S. Becker, A. Hamelin, F. Guellec, P. Imperinetti, W. Rabaud
CEA-LETI-MINATEC, Grenoble, France

The conference's forums include F4 Scientific Imaging forum having few nice overview presentations:

Overview of Scientific Imaging in the Frequency Range from X-Rays to Terahertz
Valérie Nguyen, CEA Leti MINATEC, Grenoble, France

Multispectral Imaging: When CMOS Does the Trick!
Matteo Perenzoni, Fondazione Bruno Kessler, Torento, Italy

Ultra-High-Speed Imaging
Shigetoshi Sugawa, Tohoku University, Sendai, Japan

Single-Photon Imaging with SPADs
Robert Henderson, University of Edinburgh, Edinburgh, UK

State-of-the-Art in Uncooled IR Sensors and Readout Circuitry
Patrick Robert, ULIS, Veurey-Voroize, France

High-Sensitivity Astronomical-Imaging Arrays with Cryogenic Electronics for Terahertz Waves
Hiroshi Matsuo, National Observatory of Japan, Tokyo, Japan

THz Imaging: What You See and What You Don’t!
Peter H. Siegel, Caltech/JPL, Pasedena, CA

Advanced Microwave Imaging Based on Modern Semiconductor Technologies
Sherif-Sayed Ahmed, Rohde & Schwarz, Munich, Germany

THz CMOS Image Sensors Using Schottky Barrier Diodes for Lensless Portable Applications
Kenneth O, University of Texas at Dallas, Dallas, TX