Aptina Announces 1.1um and 1.4um BSI Pixels

Business Wire: Aptina announced that it will be showing its new 1.1 and 1.4-micron backside BSI sensors at the 2011 Mobile World Congress in Barcelona, Spain. Invited guests will see a live demonstration of an 8MP 1/4” 1.1-micron BSI image sensor, and an 8MP 1/3.2” 1.4-micron BSI image sensor for mobile applications. “We strive for the perfect pixel,” said Gennadiy Agranov, Vice President of Imaging Technology. “Aptina A-Pix technology raised the bar for FSI performance, and now, A-Pix technology is advancing the performance of BSI solutions.”

Aptina expects its AR0833, 1/3.2" 1.4-micron 8MP BSI image sensor will be its first BSI product to sample starting in mid-2011. In the second half of 2011, Aptina expects to sample 1.1-micron BSI products including a 12MP 1/3.2” 1.1-micron image sensor, and an 8MP 1/4” 1.1-micron image sensor.

Aptina is currently working with its fabrication partner Micron Technology to support BSI production capacity by CYQ3 2011 in anticipation of ramping products to be manufactured for mobile, digital still and digital video camera applications.

Demand for BSI CMOS image sensors is expected to grow from 10% of cell phone main cameras in 2011 to 20% in 2013, according to TSR.

Business Wire: Other live demos at Barcelona exhibition include:

• 3D video and depth sensing using Aptina’s sensors and mobile-compatible camera module
• Advanced DSC-like capabilities using Aptina’s image co-processor for mobile applications
• Integrated AF module using a liquid crystal AF element

Here is a  VGA picture from 1.1um pixel sensor:

Captured with Aptina 8MP 1.1um BSI Development Product (Photo: Business Wire)