Ziptronix Sues Omnivision, TSMC over BSI Patents Infringement

ElectroIQ: Ziptronix filed a complaint of patent infringement against Omnivision and TSMC over infringement on several patents dealing with low-temperature oxide bonding.

Omnivision writes in its recent 10-Q form:

"On December 6, 2010, Ziptronix, Inc., or Ziptronix, filed a complaint against the Company alleging patent infringement in the District Court for the Northern District of California. The case is entitled Ziptronix, Inc. v. OmniVision Technologies, Inc., Taiwan Semiconductor Manufacturing Company Ltd., and TSMC North America Corp., Case No. CV10-05525. In its complaint, Ziptronix asserts that the Company has made, used, offered to sell, sold and/or imported into the United States products that infringe U.S. Patent Nos. 7,387,944 (“Method for Low Temperature Bonding and Bonded Structure”), 7,335,572 (“Method for Low Temperature Bonding and Bonded Structure”), 7,553,744 (“Method for Low Temperature Bonding and Bonded Structure”), 7,037,755 (“Three Dimensional Device Integration Method and Integrated Device”), 6,864,585 (“Three Dimensional Device Integration Method and Integrated Device”), and 7,807,549 (“Method for Low Temperature Bonding and Bonded Structure”). The complaint seeks unspecified monetary damages, fees and expenses and injunctive relief against the Company. The Company expects to vigorously defend itself against Ziptronix’s allegations. At this time, the Company cannot estimate any possible loss or predict whether this matter will result in any material expense to it."

Thanks to anonymous commenter to Omnivision post from Jan. 6!

Update: As said in the comments, there is a more detailed discussion of bonding techniques and potential Ziptronix advantage in Phil Garrou blog.