Yole on Ziptronix vs Omnivision and TSMC Suit

I-Micronews: Yole Développement discusses the recent Ziptronix suit vs Omnivision and TSMC, quotes Ziptronix CEO Dan Donabedian saying in 2009: "Anyone running a low temperature oxide bonding process as part of their manufacturing scheme is likely to be infringing on our IP".

Yole also gives a 2009 CIS wafer fabs market shares with TSMC leading the list:

Thanks to J.B. for sending me the link!