IEEE CPMT Society presents "High-Reliability Through-Silicon Via (TSV) Solutions for Image Sensor Packaging" lecture by Belgacem Haba, Fellow and Chief Technology Officer, Interconnect, Components & Materials (ICM), Tessera on January 13, 2010 in Santa Clara, CA.
"In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 – providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce TSV wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach."
"In 2009, the industry shipped 2.5 billion image sensor units with an average selling price of $5 – providing a total addressable market of $12B. This presentation will discuss image sensor and camera module trends and growth. It will trace the growing movement in the image sensor market from chip-on-board to wafer-level packaging for cost savings and other advantages. It also will trace the image sensor evolution toward wafer-level packaging and introduce TSV wafer-level chip-scale packaging, and how to address the barriers to adoption with a new approach."
Tessera Talks about TSV Reliability
![Tessera Talks about TSV Reliability]()
Reviewed by MCH
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January 07, 2010
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