EV Group Installs Fusion Wafer Bonders at Two Image Sensor Manufacturing Facilities in Asia

Yahoo: EV Group (EVG) announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI FB automated production fusion bonding systems will be employed for the production of BSI CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors.