Philip Garrou from Semiconductor International anticipates a surge of activity in TSV and 3D integration in image sensors. He summarizes TSV activities by all the leading image sensor makers in his nice blog message from a month ago. A newer post paints a bigger picture where image sensor TSV adoption is just a first step of large scale TSV move.
TSV Rollercoaster
Reviewed by MCH
on
October 20, 2008
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