SUSS MicroTec announces world's first production-grade wafer bonder specifically optimized for BSI and 3D-integrated image sensor manufacturing. The bonder is presented at Semicon Taiwan, starting today. The BSI industry seems to wind-up.
The bonder is designed for 300mm wafers, while most of the image sensor production today uses 200mm. This might limit the bonder use in the short term.
The bonder is designed for 300mm wafers, while most of the image sensor production today uses 200mm. This might limit the bonder use in the short term.
SUSS Supports BSI Trend
![SUSS Supports BSI Trend]()
Reviewed by MCH
on
September 08, 2008
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