Samsung Uses TSVs in its Sensors

Digitimes quotes new rumors on Samsung image sensors:

1. Samsung decided to use another 8-inch fab for sensor production
2. Samsung is said to ship image sensor dice instead of wafers to its customers. Samsung used to sell image sensor wafers only, while OmniVision has sold COB packaged dies. (It's a mistake in the article. Omnivision uses CSP, rather than COB.)
   
3. Samsung's new products are produced using TSV. Digitimes sources say that "customers only need to add a controller IC to complete the camera module." - I don't understand this statement. Probably they mean ISP.