2009 International Image Sensor Workshop published Call for Papers.
Papers on the following topics are solicited:
Image Sensor Design
-CCDs, Active pixels, CMOS, CIDs, APD array, etc.
-New Devices, Pixels, Structures, Circuits
-Low Noise and Cross-talk, High QE, Large Full-well
-ADCs for Image Sensors
-Improved Color Rendition
-High Frame Rate Sensors
Imaging System-on-a-Chip (ISOC)
-Single Chip Digital Imager
-Small Pixel, Large Format, Low Power
-Sensors for DSC, Mobile Phones, SLR Camera
-On-chip Color and Image Processing (demosaicing, temporal and fixed-pattern noise reduction, etc)
Scientific Imagers
-Very Large Format Imagers
-High Sensitivity Imaging, EBCCD, APD
-Enhanced Spectral Response (NIR, IR)
-X-ray, UV, Particle Detectors
-Line Arrays, TDI, Imagers for Remote Sensing
Application Specific Imagers
-Range Imaging (3D CIS, RGBZ)
-Computational Sensors
-High Dynamic Range Imaging
-Sensors for Machine Vision
-Radiation Hard Imagers
Image Sensor Fabrication and Packaging
-Improvements in Fabrication Process
-Wafer Level Cameras
-New Imaging Materials
-Nanotechnologies for Imaging
-Color Filters and Microlenses
-“3D” Integration, Packaging
-Backside Thinning
Test and Analysis
-Improved Device and Circuit models
-Measurement Techniques
-Problems of Small Pixels
-New Device Physics and Phenomenology
-Reliability, Yield, Cost
Papers on the following topics are solicited:
Image Sensor Design
-CCDs, Active pixels, CMOS, CIDs, APD array, etc.
-New Devices, Pixels, Structures, Circuits
-Low Noise and Cross-talk, High QE, Large Full-well
-ADCs for Image Sensors
-Improved Color Rendition
-High Frame Rate Sensors
Imaging System-on-a-Chip (ISOC)
-Single Chip Digital Imager
-Small Pixel, Large Format, Low Power
-Sensors for DSC, Mobile Phones, SLR Camera
-On-chip Color and Image Processing (demosaicing, temporal and fixed-pattern noise reduction, etc)
Scientific Imagers
-Very Large Format Imagers
-High Sensitivity Imaging, EBCCD, APD
-Enhanced Spectral Response (NIR, IR)
-X-ray, UV, Particle Detectors
-Line Arrays, TDI, Imagers for Remote Sensing
Application Specific Imagers
-Range Imaging (3D CIS, RGBZ)
-Computational Sensors
-High Dynamic Range Imaging
-Sensors for Machine Vision
-Radiation Hard Imagers
Image Sensor Fabrication and Packaging
-Improvements in Fabrication Process
-Wafer Level Cameras
-New Imaging Materials
-Nanotechnologies for Imaging
-Color Filters and Microlenses
-“3D” Integration, Packaging
-Backside Thinning
Test and Analysis
-Improved Device and Circuit models
-Measurement Techniques
-Problems of Small Pixels
-New Device Physics and Phenomenology
-Reliability, Yield, Cost
Image Sensor Workshop Call For Papers Published
Reviewed by MCH
on
September 23, 2008
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