Intertech-Pira holds 2008 Image Sensors Conference, this time in San Diego on Nov. 17-19. It's mostly marketing event and it has quite a few interesting presentations in the agenda:
Pre-conference seminar: Image processing challenges in the world of small pixels
Dr Frederic Guichard, Chief Scientist Officer, DXO LABS, France
Current status and future trends in imaging
Jason Hartlove, Imaging Industry Executive, GREENWAY CAPITAL AND MANAGEMENT, US
Market trends and prognosis for image sensors
Shri Sundaram, Manager, Business Development, TOSHIBA, US
Handsets: Mpixels, small pixels and image quality challenges
Arie Gavriely, Director of Marketing /Business Development ADVASENSE, Israel
Creating big results from small pixels in camera phones
Feisal Mosleh, CMOS WW Marketing and Business Development Director, EASTMAN KODAK, US
Reflow: Compatible wafer-level CMOS imaging lenses
Jyrki Saarinen, SVP of Marketing and Business Development, HEPTAGON, Finland
RICA architecture for camera phone image processing
Graham Townsend, CEO, SPIRAL GATEWAY, UK
Liquid lens: The best solution for camcorder phones
John Barber, VP Marketing, VARIOPTIC, France
Hardware accelerated capturing software
Sami Neimi, CTO, SCALADO, Sweden
Mobile imaging in emerging markets
Saku Hieta, Director, Camera Sourcing, NOKIA, Finland
Why will all optics be digital?
Frederic Guichard, Chief Scientist Officer, DXO, France
Benefits of xenon flash for today’s mobile phone cameras
Rudi Blondia, Director of Lighting Technology, PERKINELMER, US
Backside illumination technology
Michael Okincha, Business Development and Technical Marketing Manager, OMNIVISION, US
Development of a fully-depleted, thick back-illuminated CCD with high sensitivity to visible and near-infrared wavelengths
John Gilmore, Manager, Image Sensor Group, HAMAMATSU, US
Advances in CMOS image sensors
Homayoon Haddad, Director, Advanced Pixel Research Center, MAGNACHIP, US
Low-noise CMOS sensor for high-quality imaging
Hirofumi Sumi, Distinguished Researcher, SONY CORPORATION, JAPAN
Standard CMOS single chip time of flight sensors
Cyrus Bamji, CTO, CANESTA, US
Its time to go small
Mark Boomgarden, VP of Wafer-Level Camera, TESSERA, US
Application specific CMOS imagers for defense and space
John Tower, Technical Director, SARNOFF CORPORATION, US
Image sensor requirements for 2D barcode scanners
Bradley S Carlson, Senior Principal Engineer, MOTOROLA, US
Industrial/professional imaging differentiation
Gareth Powell, CMOS Marketing Manager, E2V, France
Image sensor requirements for retinal prosthesis
Kelly McClure, Sr Director of Externals Engineering, SECOND SIGHT, US
High dynamic range sensor requirements for vehicle imaging applications
Kenji Tashiro, R&D Engineer, JAI INC, US
CMOS imaging system-on-chip for HD video and beyond
Lester J Kozlowski, CTO and Founder, ALTASENS, US
Image sensing requirements in surveillance applications
Ricardo J Motta, CTO and Vice-President of Imaging, PIXIM, US
Pre-conference seminar: Image processing challenges in the world of small pixels
Dr Frederic Guichard, Chief Scientist Officer, DXO LABS, France
Current status and future trends in imaging
Jason Hartlove, Imaging Industry Executive, GREENWAY CAPITAL AND MANAGEMENT, US
Market trends and prognosis for image sensors
Shri Sundaram, Manager, Business Development, TOSHIBA, US
Handsets: Mpixels, small pixels and image quality challenges
Arie Gavriely, Director of Marketing /Business Development ADVASENSE, Israel
Creating big results from small pixels in camera phones
Feisal Mosleh, CMOS WW Marketing and Business Development Director, EASTMAN KODAK, US
Reflow: Compatible wafer-level CMOS imaging lenses
Jyrki Saarinen, SVP of Marketing and Business Development, HEPTAGON, Finland
RICA architecture for camera phone image processing
Graham Townsend, CEO, SPIRAL GATEWAY, UK
Liquid lens: The best solution for camcorder phones
John Barber, VP Marketing, VARIOPTIC, France
Hardware accelerated capturing software
Sami Neimi, CTO, SCALADO, Sweden
Mobile imaging in emerging markets
Saku Hieta, Director, Camera Sourcing, NOKIA, Finland
Why will all optics be digital?
Frederic Guichard, Chief Scientist Officer, DXO, France
Benefits of xenon flash for today’s mobile phone cameras
Rudi Blondia, Director of Lighting Technology, PERKINELMER, US
Backside illumination technology
Michael Okincha, Business Development and Technical Marketing Manager, OMNIVISION, US
Development of a fully-depleted, thick back-illuminated CCD with high sensitivity to visible and near-infrared wavelengths
John Gilmore, Manager, Image Sensor Group, HAMAMATSU, US
Advances in CMOS image sensors
Homayoon Haddad, Director, Advanced Pixel Research Center, MAGNACHIP, US
Low-noise CMOS sensor for high-quality imaging
Hirofumi Sumi, Distinguished Researcher, SONY CORPORATION, JAPAN
Standard CMOS single chip time of flight sensors
Cyrus Bamji, CTO, CANESTA, US
Its time to go small
Mark Boomgarden, VP of Wafer-Level Camera, TESSERA, US
Application specific CMOS imagers for defense and space
John Tower, Technical Director, SARNOFF CORPORATION, US
Image sensor requirements for 2D barcode scanners
Bradley S Carlson, Senior Principal Engineer, MOTOROLA, US
Industrial/professional imaging differentiation
Gareth Powell, CMOS Marketing Manager, E2V, France
Image sensor requirements for retinal prosthesis
Kelly McClure, Sr Director of Externals Engineering, SECOND SIGHT, US
High dynamic range sensor requirements for vehicle imaging applications
Kenji Tashiro, R&D Engineer, JAI INC, US
CMOS imaging system-on-chip for HD video and beyond
Lester J Kozlowski, CTO and Founder, ALTASENS, US
Image sensing requirements in surveillance applications
Ricardo J Motta, CTO and Vice-President of Imaging, PIXIM, US
Intertech-Pira 2008 Image Sensors Conference
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August 27, 2008
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